Accurately tests structures up to 10 µm in diameter. Docking station for FOUP, SMIF and cassette, for 6″, 8″ and 12″ wafers. The handling and measurement inside the XDV-μ SEMI takes place entirely without manual intervention. Thanks to pattern recognition, the XRF gauge locates the specified measuring positions precisely and reliably. This automatic measuring process rules out damage and contamination caused by manual handling and ensures high throughput rates for inspecting valuable wafers.