Electronic parts, terminals, and pins are electroplated with a variety of metals to achieve good corrosion resistance and electrical properties. These metals include gold, silver, palladium, tin, and nickel. Accurate and precise measurement of such plating is critical in achieving the reliability and performance that is demanded from our electronic devices. Accurate and precise measurements […]
Anodized aluminum is used for both decorative and function purposes. The thickness of the anodic plating plays a critical role in products from consumer goods, aerospace parts, and automotive chassis. Meeting industry specifications such as MIL-A 8265 Type III require accurate and precise measurement of anodized aluminum thicknesses. The measuring instruments shown below provide just […]
Thickness measurement of metallized layers in semiconductor and wafer fabrication is a critical process step. Metallization processes such as PVD, PECVD, and electroplating can easily be measured using XRF. Several systems use polycapillary optics, pattern recognition, and high precision X/Y stages, and can measure on features as small as 10 µm. The XDV-µ Semi, in […]
Printed circuit board manufacturers use many different surface finishes depending on the required function. Finishes such as ENIG (IPC-4552B), ENEPIG (IPC-4556), EPIG, EPAG, and immersion tin all require accurate and precise measurement for plating thickness. The below instruments are ideally suited for such measuring. FISCHERSCOPE® X-RAY XDAL®-PCB View More FISCHERSCOPE® X-RAY XDLM®-PCB View […]
