Thickness measurement of metallized layers in semiconductor and wafer fabrication is a critical process step. Metallization processes such as PVD, PECVD, and electroplating can easily be measured using XRF. Several systems use polycapillary optics, pattern recognition, and high precision X/Y stages, and can measure on features as small as 10 µm. The XDV-µ Semi, in particular, integrates very well into today’s automated semiconductor manufacturing environment.